Three-Dimensional Integration and Device Lab.
About the Laboratory & Research Area
Under Professor Woo Young Choi's guidance, the Three-Dimensional Integration and Device Lab (TIDL) is conducting research to overcome semiconductor device integration, power consumption, and functional limitations.
The technologies developed in TIDL are applied to memory devices, logic/analog/foundry devices, brain-inspired computing devices, extremely-low-power devices, and three-dimensional heterogeneous integration.
The technologies developed in TIDL are applied to memory devices, logic/analog/foundry devices, brain-inspired computing devices, extremely-low-power devices, and three-dimensional heterogeneous integration.
Research Interests & Projects
Design, fabrication, characterization and theoretical analysis of semiconductor devices
Nanoscale MOSFETs
Emerging logic/analog/memory devices
Brain-inspired computing
Three-dimensional integration
Nanoscale MOSFETs
Emerging logic/analog/memory devices
Brain-inspired computing
Three-dimensional integration
Journals & Patents
아래 링크 참고 바랍니다 (Google Scholar 및 연구실 홈페이지)
https://scholar.google.com/citations?user=mvZELroAAAAJ&hl=ko&oi=ao
https://sites.google.com/view/snutidl/publication/journal?authuser=0
https://scholar.google.com/citations?user=mvZELroAAAAJ&hl=ko&oi=ao
https://sites.google.com/view/snutidl/publication/journal?authuser=0
